Induino was assembled using thru-hole technology(thru-hole mounted), even though one of the chip namely FTDI (Future technology Devices international) is a SMD chip(which requires quite a bit of soldering expertise). More of this here.
Induino unlike Arduino have lot many components on-board which assists in direct interaction than making use of additional electrical components(will require to use the component as the neurons demand more - in future)
| Atmega 328 - DIP(Dual inline packaging)ref: Datasheet | |
| 8-bit microcontroller | |
| Advanced RISC architecture | |
| 131 instructions | |
| 32x8 general purpose working registers | |
| 20 MIPS throughput at 20MHz | |
| 32K bytes of In-System self-programmable flash program memory | |
| 1K bytes EEPROM | |
| 2K bytes internal SRAM | |
| Induino On-board peripherals (other than the man in charge Atmega328) | |
| 1 x TSOP(Thin small outline package) IR receiver | |
| 1 x IR LED | |
| 1 x LDR(Light Dependent Resistor) photo resistor | |
| 1 x RGB LED | |
| FTDI | |
| 3 x LEDs | |
| DIP switches | |
| and many more | |
To include
FTDI
UART
ICSP/ISP
